660-29AB Wakefield Thermal, HEAT SINK | Farnell ES
394-1AB Wakefield Thermal, HEAT SINK, BLACK ANODIZED | Farnell ES
CEBF0140401605-00 Malico, Fan / Force Cooled Heat Sink, BGA, Chip Set | Farnell Spain
7021B-MTG Boyd, HEAT SINK | Farnell ES
573300D00000G Boyd, HEAT SINK | Farnell ES
678-39-C Wakefield Thermal, HEAT SINK, ALUMINIUM, TO-PACKAGE | Farnell ES
Y92B-A100 Omron Industrial Automation, HEATSINK | Farnell ES
290-1AB Wakefield Thermal, HEAT SINK | Farnell ES
PI HEATSINK KIT Multicomp, Kit de Disipadores de Calor para Raspberry Pi con Cinta Adhesiva Térmica de 50mm x 50mm | Farnell ES
394-2AB Wakefield Thermal, HEATSINK, NATURAL CONVECTION, 1.51°C/W | Farnell ES
193AB2500B Abl Heatsinks, Disipador de Calor, 0.32 °C/W, 240 mm | Farnell ES
501403B00000G Boyd, HEAT SINK | Farnell ES
651-B Wakefield Thermal, HEAT SINK | Farnell ES
7138DG Boyd, HEAT SINK | Farnell ES
421K Wakefield Thermal, HEAT SINK | Farnell ES
CCI10 Cci, Disipador de Calor, BGA, FPGAs | Farnell ES
641K Wakefield Thermal, HEAT SINK | Farnell ES
193AB1500B Abl Heatsinks, Disipador de Calor, 0.4 °C/W, 240 mm | Farnell ES
7023B-MTG Boyd, HEAT SINK | Farnell ES
